The MaAnt iPhone XS Max Middle Layer Reballing Stencil is a precision BGA reballing stencil designed for Apple iPhone XS Max logic board and middle-layer motherboard repair. Manufactured from premium stainless steel with precision laser-cut openings, it provides accurate solder ball placement for reliable and efficient chip-level repairs.
With a 0.12 mm thickness, the stencil offers excellent heat resistance, durability, and dimensional stability, making it ideal for repeated professional use. It is specifically engineered for middle-layer motherboard rework, CPU and IC reballing, and logic board restoration, helping technicians achieve precise alignment and high-quality repair results.
Frequently Bought Together
Products from this Seller
View All
Register now & get ₹50 in your wallet! Subscribe to our newsletter for exclusive coupons, special offers, and exciting discounts. Don't miss out—join today!
Share with Friends
Trading is more effective when you share products with friends!Share you link
Share to