MaAnt iPhone XS Max Middle Layer Reballing Stencil

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SKU 178386260815671
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The MaAnt iPhone XS Max Middle Layer Reballing Stencil is a precision BGA reballing stencil designed for Apple iPhone XS Max logic board and middle-layer motherboard repair. Manufactured from premium stainless steel with precision laser-cut openings, it provides accurate solder ball placement for reliable and efficient chip-level repairs.

With a 0.12 mm thickness, the stencil offers excellent heat resistance, durability, and dimensional stability, making it ideal for repeated professional use. It is specifically engineered for middle-layer motherboard rework, CPU and IC reballing, and logic board restoration, helping technicians achieve precise alignment and high-quality repair results.

Key Features

  • Designed for Apple iPhone XS Max middle-layer motherboard repair
  • Premium stainless steel construction
  • Precision laser-cut holes for accurate solder ball placement
  • 0.12 mm thickness for professional BGA reballing
  • Heat-resistant, durable, and reusable
  • Ideal for logic board, CPU, and IC repair
  • Lightweight and easy to align during repair
  • Suitable for professional mobile repair technicians and service centers

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