The Luowei SP3 Black Small Can Solder Paste is a premium anti-oxidant, non-conductive soldering compound specially developed for mobile phone repair, PCB maintenance, BGA rework, and precision electronic soldering applications. Its advanced formulation helps prevent oxidation during heating while improving solder flow and wetting performance.
The SP3 solder paste features a no-resistance and non-conductive formula, making it safe for use around sensitive electronic components and densely packed circuit boards. It enhances solder joint quality, reduces oxidation, and ensures clean, reliable connections during repair and rework operations.
Packaged in a convenient 30g container, the SP3 is ideal for professional technicians, repair centers, and electronics enthusiasts seeking consistent soldering performance.
Key Features:
• Anti-oxidant formulation for cleaner solder joints
• Non-conductive and no-resistance formula
• Improves solder flow and wetting performance
• Reduces oxidation during soldering
• Suitable for precision PCB and motherboard repairs
• Helps create strong and reliable solder connections
• Easy application and excellent thermal stability
• Ideal for mobile phone, laptop, and electronics repair
• Compact 30g container for professional use
Applications:
• Mobile phone motherboard repair
• BGA rework and chip soldering
• PCB maintenance and repair
• Micro-soldering applications
• Electronics assembly and rework
• Laptop and tablet repairs
• Professional repair workshops
Specifications:
• Model: SP3
• Brand: Luowei
• Type: Anti-Oxidant Solder Paste
• Formula: Non-Conductive / No Resistance
• Net Weight: 30g
• Color: Black
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