The MaAnt IP11 Pro Max Layer Stencil is a professional-grade BGA reballing stencil designed specifically for iPhone 11 Pro Max motherboard and middle-layer repair. Crafted from premium stainless steel with precision laser-cut openings, it provides accurate solder ball alignment and uniform solder paste application for reliable chip-level repairs.
Designed for professional mobile repair technicians, this reusable stencil offers exceptional durability, heat resistance, and corrosion resistance, making it ideal for IC reballing, CPU repair, motherboard restoration, and PCB maintenance.
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