Amaoe Z Flip3 5G SM-F711U/B/N/0/D/W 0.12mm Middle Layer Motherboard BGA Reballing Stencil

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SKU 178429174967272
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The Amaoe Z Flip3 5G SM-F711U/B/N/0/D/W 0.12mm Middle Layer Motherboard BGA Reballing Stencil is a precision repair tool designed specifically for the Samsung Galaxy Z Flip3 5G series. Manufactured from premium Japanese steel, this stencil features precision laser-cut square holes for accurate solder ball placement and reliable motherboard reballing.

Designed for professional mobile repair technicians, the stencil offers excellent durability, high heat resistance, and precise alignment for chip-level repairs and motherboard restoration.

Compatible Models:

  • Samsung Galaxy Z Flip3 5G SM-F711U
  • Samsung Galaxy Z Flip3 5G SM-F711B
  • Samsung Galaxy Z Flip3 5G SM-F711N
  • Samsung Galaxy Z Flip3 5G SM-F7110
  • Samsung Galaxy Z Flip3 5G SM-F711D
  • Samsung Galaxy Z Flip3 5G SM-F711W

Features:

  • Premium Japanese steel construction
  • Precision laser-cut square-hole design
  • 0.12mm thickness for accurate BGA reballing
  • Specifically designed for Samsung Galaxy Z Flip3 5G
  • Heat-resistant and reusable
  • High solder ball alignment accuracy
  • Durable for long-term professional use
  • Ideal for motherboard and chip-level repair

Applications:

  • Samsung Galaxy Z Flip3 5G motherboard repair
  • Middle layer PCB reballing
  • BGA IC rework
  • Mobile phone chip-level repair
  • Professional repair laboratories and service centers

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