Amaoe X9P+012 Stencil for Vivo X90 Pro+ Middle Layer Motherboard Reballing

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Product Description

The Amaoe X9P+012 Stencil is a professional 0.12mm middle layer motherboard reballing stencil specially designed for the Vivo X90 Pro+. Manufactured from premium Japanese steel, this stencil features precision laser-cut square holes for accurate solder paste application and reliable BGA reballing.

Its reusable and heat-resistant construction ensures consistent solder ball alignment, making it an ideal choice for professional mobile repair technicians performing motherboard restoration and chip-level repairs.

Features:

• Premium Japanese steel sheet
• Super hard and durable construction
• Precision laser-cut square-hole design
• 0.12mm thickness
• Designed specifically for Vivo X90 Pro+ middle layer motherboard reballing
• High heat resistance
• Reusable for long-term professional use
• Provides accurate solder ball positioning and reliable repair results

Applications:

• Vivo X90 Pro+ motherboard repair
• Middle layer PCB reballing
• BGA chip rework
• Mobile phone motherboard maintenance
• Professional chip-level repair

The stencil is specifically designed for the Vivo X90 Pro+ middle-layer motherboard and features a reusable 0.12mm Japanese steel construction with square apertures.