Amaoe WC1 0.12mm Stencil for WiFi Qualcomm WCD/WCN IC

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SKU 178428483320200
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The Amaoe WC1 0.12mm Stencil is a precision BGA reballing stencil specially designed for Qualcomm WCD and WCN WiFi/RF IC repair. Manufactured from premium Japanese stainless steel with a 0.12mm thickness, it provides exceptional durability, precise alignment, and consistent solder ball placement for professional BGA rework.

Its high-precision laser-cut apertures ensure accurate solder paste application, making it ideal for reballing Qualcomm WiFi, RF, Bluetooth, and audio ICs commonly found on smartphone motherboards. The stencil is reusable, heat-resistant, and suitable for advanced motherboard repair and IC replacement.

Features:

  • Premium Japanese stainless steel construction
  • Precision 0.12mm thickness
  • Designed for Qualcomm WCD & WCN WiFi/RF IC reballing
  • High-precision laser-cut aperture design
  • Accurate solder ball positioning
  • Reusable and heat-resistant
  • Ideal for smartphone motherboard and RF IC repair
  • Suitable for professional BGA and SMD rework

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