The Amaoe WC1 0.12mm Stencil is a precision BGA reballing stencil specially designed for Qualcomm WCD and WCN WiFi/RF IC repair. Manufactured from premium Japanese stainless steel with a 0.12mm thickness, it provides exceptional durability, precise alignment, and consistent solder ball placement for professional BGA rework.
Its high-precision laser-cut apertures ensure accurate solder paste application, making it ideal for reballing Qualcomm WiFi, RF, Bluetooth, and audio ICs commonly found on smartphone motherboards. The stencil is reusable, heat-resistant, and suitable for advanced motherboard repair and IC replacement.
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