Amaoe Vivo X70 Pro+ 0.12mm Middle Layer Motherboard BGA Reballing Stencil

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SKU 178429132567190
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The Amaoe Vivo X70 Pro+ 0.12mm Middle Layer Motherboard BGA Reballing Stencil is a high-precision repair tool designed specifically for the Vivo X70 Pro+ motherboard. Made from premium Japanese steel, this stencil features precision laser-cut square holes for accurate solder ball placement and reliable BGA reballing.

Its durable, heat-resistant, and reusable construction ensures consistent performance during motherboard restoration and chip-level repairs, making it an excellent choice for professional mobile repair technicians.

Features:

  • Premium Japanese steel construction
  • Precision laser-cut square-hole design
  • 0.12mm thickness for accurate reballing
  • Specifically designed for Vivo X70 Pro+ motherboard repair
  • High heat resistance and long service life
  • Reusable for multiple repair jobs
  • Accurate solder ball alignment for reliable repair results
  • Ideal for professional chip-level and motherboard repair

Applications:

  • Vivo X70 Pro+ motherboard repair
  • Middle layer PCB reballing
  • BGA IC rework and maintenance
  • Mobile phone chip-level repair
  • Professional mobile service centers

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