The Amaoe UN2 Stencil is a high-precision BGA reballing stencil designed for professional smartphone motherboard and IC repair. Manufactured from premium Japanese stainless steel with a 0.12mm thickness, it offers exceptional durability, precise chip alignment, and consistent solder ball placement for reliable BGA rework.
Its precision laser-cut apertures ensure uniform solder paste application, making it suitable for reballing a variety of CPU, RAM, and BGA IC chips used in smartphones and other electronic devices. The stencil is reusable, heat-resistant, and an essential tool for professional mobile repair technicians.
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