AMAOE UN1 BGA Reballing Stencil for Universal IC Repair

0 /5.0 (0 reviews)
SKU 178418745820599
People are viewing right now
Pricing
Rs149 /PC
Rs176
-15%

50 available

Minimum order qty 1

QTY
seller

Inhouse product

Message Seller
  • warranty check circle Refund Available for this producte

The AMAOE UN1 BGA Reballing Stencil is a professional-grade universal stencil designed for accurate reballing of mobile phone CPU and IC chips. Manufactured from premium laser-cut stainless steel, it ensures precise solder ball placement for reliable BGA chip repair and motherboard maintenance.

Built for durability and repeated use, the UN1 stencil offers excellent heat resistance and dimensional accuracy, making it an essential tool for professional technicians performing advanced IC replacement and motherboard rework on a wide range of smartphones.

Features:

  • High-quality laser-cut stainless steel construction
  • Universal design for mobile CPU and IC reballing
  • Accurate solder ball alignment for reliable repairs
  • Heat-resistant, corrosion-resistant, and reusable
  • Durable construction for long-term professional use
  • Suitable for BGA chip repair and motherboard maintenance
  • Ideal for mobile phone repair technicians

Reviews & Ratings

0.0

Total Review 0

No reviews found!

Product Queries (0)

Login Or Registerto submit your questions to seller

Other Questions

No queries have been asked to the seller yet

Frequently Bought Together

No frequently bought products found!
All categories
Flash Sale
Todays Deal
Auction