The Amaoe UAV1 Stencil is a high-precision BGA reballing stencil designed for professional smartphone motherboard and IC repair. Manufactured from premium Japanese stainless steel with a precision 0.12mm thickness, it provides accurate solder ball alignment and consistent solder paste application during CPU and RAM reballing.
Its laser-cut aperture design ensures precise positioning, making it suitable for repairing a wide range of mobile phone ICs. The stencil is heat-resistant, reusable, and built for long-term professional use in mobile repair workshops.
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