AMAOE U-UNI1 Universal BGA Reballing Stencil for Mobile IC Repair

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SKU 178418831964198
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The AMAOE U-UNI1 Universal BGA Reballing Stencil is a high-precision stainless steel stencil designed for professional reballing of various mobile phone CPU and IC chips. Precision laser-cut openings ensure accurate solder ball placement, providing reliable results for BGA chip repair, motherboard maintenance, and IC replacement.

Made from premium-grade stainless steel, the U-UNI1 stencil is highly durable, heat-resistant, and reusable, making it an essential tool for mobile phone repair technicians and service centers. Its universal design supports a wide range of IC repair applications.

Features:

  • Premium laser-cut stainless steel construction
  • Universal design for mobile CPU and IC reballing
  • High-precision solder ball alignment
  • Heat-resistant and corrosion-resistant
  • Reusable and durable for long-term use
  • Ideal for motherboard repair and IC replacement
  • Suitable for professional mobile repair workshops

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