The AMAOE U-UNI1 Universal BGA Reballing Stencil is a high-precision stainless steel stencil designed for professional reballing of various mobile phone CPU and IC chips. Precision laser-cut openings ensure accurate solder ball placement, providing reliable results for BGA chip repair, motherboard maintenance, and IC replacement.
Made from premium-grade stainless steel, the U-UNI1 stencil is highly durable, heat-resistant, and reusable, making it an essential tool for mobile phone repair technicians and service centers. Its universal design supports a wide range of IC repair applications.
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