Amaoe U-UFS1 Stencil for eMMC, eMCP, UFS, UMCP & LPDDR IC Reballing

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SKU 178428999957295
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Rs176
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The Amaoe U-UFS1 Stencil is a professional BGA reballing stencil specially designed for UFS, eMMC, eMCP, UMCP, and LPDDR memory ICs used in modern smartphones and tablets. Manufactured from premium Japanese steel with a precision laser-cut 0.12mm thickness, it ensures accurate solder ball placement and reliable reballing performance.

Its reusable, heat-resistant construction makes it ideal for professional mobile repair technicians performing memory IC replacement and motherboard repairs.

Features:

  • Premium Japanese steel construction
  • Precision laser-cut square-hole design
  • 0.12mm thickness for accurate reballing
  • Compatible with UFS, eMMC, eMCP, UMCP, and LPDDR memory ICs
  • Heat-resistant and reusable
  • High precision solder ball alignment
  • Suitable for professional motherboard and chip-level repair

Applications:

  • UFS Memory IC Reballing
  • eMMC Storage IC Repair
  • eMCP & UMCP Chip Rework
  • LPDDR RAM Reballing
  • Smartphone Motherboard Repair
  • Professional BGA Rework Stations 

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