Amaoe U-SMU3 Stencil for Exynos CPU & RAM

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SKU 178427189113850
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The Amaoe U-SMU3 Stencil is a high-precision BGA reballing stencil specially designed for Samsung Exynos CPU and RAM chip repair. Made from premium Japanese stainless steel with a 0.12mm thickness, it offers excellent durability, precise alignment, and consistent solder ball placement for professional motherboard repairs.

Its laser-cut square aperture design ensures accurate solder paste application, making it ideal for reballing Exynos CPU and RAM ICs used in Samsung smartphones. The stencil is reusable, heat-resistant, and an essential tool for mobile repair technicians and electronics repair professionals.

Features:

  • Premium Japanese stainless steel construction
  • Precision 0.12mm thickness
  • Laser-cut square hole design
  • Reusable and heat-resistant
  • Designed for Samsung Exynos CPU & RAM reballing
  • Accurate solder ball positioning
  • Suitable for professional smartphone motherboard repair and BGA rework

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