Amaoe U-SMU1 Stencil

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SKU 178427672486588
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The Amaoe U-SMU1 Stencil is a professional-grade BGA reballing stencil designed for Samsung Exynos CPU and RAM chip repair. Manufactured from premium Japanese stainless steel with a precision 0.12mm thickness, it ensures accurate solder ball placement, excellent heat resistance, and long-lasting durability for advanced motherboard repair.

Its precision laser-cut apertures provide consistent solder paste distribution and precise chip alignment, making it ideal for reballing Samsung Exynos CPU and RAM ICs used in smartphones. The stencil is reusable, easy to clean, and an essential tool for professional mobile repair technicians.

Features:

  • Premium Japanese stainless steel construction
  • Precision 0.12mm thickness
  • High-accuracy laser-cut aperture design
  • Designed for Samsung Exynos CPU & RAM reballing
  • Accurate solder ball placement
  • Reusable and heat-resistant
  • Ideal for smartphone motherboard and PCB repair
  • Suitable for professional BGA and SMD rework

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