The AMAOE U-QSU6 Universal Stencil is a high-precision BGA reballing stencil designed for Qualcomm Snapdragon CPU chip repair and reballing. Manufactured from premium Japanese steel with a 0.12mm thickness, it provides precise solder ball alignment and consistent solder paste application, ensuring reliable chip-level repairs and professional reballing results.
Its precision square-hole design delivers accurate solder ball positioning while the reusable, heat-resistant construction ensures long service life. The U-QSU6 is suitable for servicing a wide range of Qualcomm Snapdragon processors, making it an essential tool for professional mobile repair technicians and motherboard repair workshops.
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