AMAOE U-QSU5 Universal Stencil for Qualcomm Snapdragon CPU Reballing

0 /5.0 (0 reviews)
SKU 178436249226492
People are viewing right now
Pricing
Rs149 /PC
Rs176
-15%

50 available

Minimum order qty 1

QTY
seller

Inhouse product

Message Seller
  • warranty check circle Refund Available for this producte

The AMAOE U-QSU5 Universal Stencil is a professional BGA reballing stencil engineered for Qualcomm Snapdragon CPU chip repair and reballing, especially newer Snapdragon Gen-series processors. Manufactured from premium Japanese stainless steel with a 0.12mm thickness, it delivers precise solder ball alignment for accurate CPU reballing and chip-level motherboard repair.

Designed with a precision laser-cut square-hole pattern, the U-QSU5 ensures uniform solder paste application and consistent solder ball placement. Its reusable, heat-resistant construction provides long service life, making it an essential tool for professional mobile phone repair technicians working on Qualcomm-based smartphones.

Features:

  • Designed for Qualcomm Snapdragon CPU reballing.
  • Compatible with newer Snapdragon Gen-series processors.
  • Premium Japanese stainless steel construction.
  • Precision 0.12mm thickness.
  • High-precision square-hole design for accurate solder ball placement.
  • Heat-resistant, corrosion-resistant, and reusable.
  • Ideal for CPU BGA reballing and professional motherboard repair. 

Reviews & Ratings

0.0

Total Review 0

No reviews found!

Product Queries (0)

Login Or Registerto submit your questions to seller

Other Questions

No queries have been asked to the seller yet

Frequently Bought Together

No frequently bought products found!
All categories
Flash Sale
Todays Deal
Auction