AMAOE U-QSU4 Stencil for Qualcomm CPU & UFS IC Reballing

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SKU 178411493690959
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The AMAOE U-QSU4 Stencil is a high-quality BGA reballing stencil designed for Qualcomm CPU and UFS IC repair. Made from premium Japanese stainless steel with precision laser-cut square holes, it ensures accurate solder ball placement and perfect IC alignment for professional smartphone motherboard repairs.

Featuring a 0.12mm thickness, the U-QSU4 stencil provides excellent durability, heat resistance, and long-lasting performance. Its reusable design makes it an essential tool for technicians performing Qualcomm CPU and UFS memory IC reballing, IC replacement, and motherboard maintenance.

Key Features:

  • Premium Japanese stainless steel construction
  • Precision laser-cut square-hole design
  • 0.12mm thickness for precise BGA reballing
  • High-temperature resistant and reusable
  • Accurate alignment for Qualcomm CPU & UFS ICs
  • Ideal for smartphone motherboard repair
  • Suitable for professional GSM and mobile repair technicians

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