AMAOE U-QSU3 Universal Stencil

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SKU 178409911919142
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The AMAOE U-QSU3 Universal Stencil is a high-precision 0.12mm BGA reballing stencil designed for professional Qualcomm CPU and IC reballing. Manufactured from premium stainless steel with precision laser-cut openings, it ensures accurate solder ball placement and uniform solder paste application for reliable chip-level repairs.

This reusable stencil is ideal for repairing smartphone motherboards, reballing Qualcomm processors, replacing ICs, and restoring PCBs. Its heat-resistant and corrosion-resistant construction ensures long-lasting performance, making it an essential tool for professional mobile phone repair technicians.

Key Features:

  • Universal stencil for Qualcomm CPU and IC reballing
  • Premium 0.12mm stainless steel construction
  • Precision laser-cut holes for accurate BGA soldering
  • Reusable, durable, and corrosion-resistant
  • Suitable for CPU, IC, motherboard, and PCB repair
  • Delivers precise solder paste alignment
  • Ideal for professional mobile repair workshops 

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