AMAOE U-QSU2 Stencil for Qualcomm Snapdragon IC Reballing

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SKU 178410404805891
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AMAOE U-QSU2 Stencil for Qualcomm Snapdragon IC Reballing is a high-precision BGA reballing stencil designed for repairing Qualcomm Snapdragon chipset ICs used in a wide range of Android smartphones. Manufactured from premium stainless steel, it provides accurate solder ball positioning and uniform solder paste application, ensuring reliable and professional reballing results.

The precision-etched stencil is durable, reusable, and resistant to deformation, making it an essential tool for chip-level motherboard repair. It is ideal for mobile repair technicians and service centers performing Qualcomm CPU and PMIC rework.

Key Features:

  • Premium stainless steel construction
  • High-precision BGA reballing design
  • Accurate solder ball alignment
  • Reusable and durable
  • Heat-resistant and corrosion-resistant
  • Designed for Qualcomm Snapdragon IC repair
  • Ideal for professional mobile phone motherboard maintenance

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