The AMAOE U-QSU1 Stencil is a high-precision BGA reballing stencil designed for Qualcomm CPU and UFS IC repair. Manufactured from premium Japanese stainless steel with precision laser-cut square holes, it ensures accurate solder ball placement and reliable IC alignment for professional motherboard repair.
With a 0.12mm thickness, the stencil offers excellent durability, high-temperature resistance, and long service life. Its reusable design makes it an essential tool for technicians performing Qualcomm CPU and UFS memory IC reballing, replacement, and motherboard maintenance.
Frequently Bought Together
Products from this Seller
View All
Register now & get ₹50 in your wallet! Subscribe to our newsletter for exclusive coupons, special offers, and exciting discounts. Don't miss out—join today!
Share with Friends
Trading is more effective when you share products with friends!Share you link
Share to