AMAOE U-QSU1 Stencil for Qualcomm CPU & UFS IC

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SKU 178411267597108
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The AMAOE U-QSU1 Stencil is a high-precision BGA reballing stencil designed for Qualcomm CPU and UFS IC repair. Manufactured from premium Japanese stainless steel with precision laser-cut square holes, it ensures accurate solder ball placement and reliable IC alignment for professional motherboard repair.

With a 0.12mm thickness, the stencil offers excellent durability, high-temperature resistance, and long service life. Its reusable design makes it an essential tool for technicians performing Qualcomm CPU and UFS memory IC reballing, replacement, and motherboard maintenance.

Key Features:

  • Premium Japanese stainless steel construction
  • Precision laser-cut square-hole design
  • 0.12mm thickness for accurate BGA reballing
  • High-temperature resistant and reusable
  • Precise alignment for Qualcomm CPU & UFS ICs
  • Designed for professional mobile motherboard repair
  • Ideal for GSM and smartphone repair technicians

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