Amaoe U-QSD9 Stencil

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SKU 178427163651908
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The Amaoe U-QSD9 Stencil is a professional-grade BGA reballing stencil designed for Qualcomm Snapdragon CPU and RAM chip repair. Manufactured from high-quality Japanese stainless steel with a precision thickness of 0.12mm, it ensures accurate solder ball placement during chip reballing and motherboard repair.

Its laser-cut square apertures provide excellent alignment and consistent solder paste application, making it ideal for repairing damaged CPU and RAM ICs in smartphones. The stencil is reusable, durable, and suitable for professional mobile repair technicians.

Features:

  • Premium Japanese stainless steel construction
  • Precision 0.12mm thickness
  • High-accuracy laser-cut square holes
  • Reusable and heat-resistant
  • Designed for Qualcomm Snapdragon CPU & RAM reballing
  • Ideal for BGA IC repair and motherboard maintenance
  • Suitable for professional mobile repair workshops

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