The Amaoe U-QSD9 Stencil is a professional-grade BGA reballing stencil designed for Qualcomm Snapdragon CPU and RAM chip repair. Manufactured from high-quality Japanese stainless steel with a precision thickness of 0.12mm, it ensures accurate solder ball placement during chip reballing and motherboard repair.
Its laser-cut square apertures provide excellent alignment and consistent solder paste application, making it ideal for repairing damaged CPU and RAM ICs in smartphones. The stencil is reusable, durable, and suitable for professional mobile repair technicians.
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