Amaoe U-QSD8 Stencil

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SKU 178384353983362
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The Amaoe U-QSD8 Stencil is a high-precision BGA reballing stencil specifically designed for Qualcomm Snapdragon CPU and power management IC repair. Manufactured from premium Japanese stainless steel with a precision laser-cut square-hole design, it delivers accurate solder ball alignment and consistent reballing performance. With a 0.12 mm thickness, excellent heat resistance, and reusable construction, this stencil is ideal for professional smartphone motherboard repair, chipset replacement, and advanced PCB maintenance. It supports a wide range of Qualcomm Snapdragon chipsets and PMICs, making it an essential tool for mobile repair technicians.

Key Features:

  • Designed for Qualcomm Snapdragon CPU and PMIC reballing
  • Premium Japanese stainless steel construction
  • Precision laser-cut square apertures for accurate solder placement
  • 0.12 mm thickness for professional reballing
  • Heat-resistant, durable, and reusable
  • Suitable for smartphone motherboard and PCB repair
  • Ideal for professional mobile repair technicians and service centers
  • Compatible with multiple Qualcomm Snapdragon chipset series 

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