Amaoe U-QSD6 Qualcomm Snapdragon CPU BGA Reballing Stencil 0.12mm

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SKU 178428973355851
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The Amaoe U-QSD6 Qualcomm Snapdragon CPU BGA Reballing Stencil is a professional-grade 0.12mm stencil designed for accurate reballing of Qualcomm Snapdragon chipsets. Made from premium Japanese steel with precision laser-cut square holes, it provides excellent solder ball alignment and consistent results during motherboard repair.

This reusable stencil is ideal for repairing flagship Qualcomm-powered smartphones and is suitable for professional mobile repair technicians and service centers.

Compatible Chipsets Include:

  • Qualcomm Snapdragon SM8150
  • Qualcomm Snapdragon SDM845
  • Qualcomm Snapdragon SM7150
  • PM8150 / PM8150A / PM8150B
  • PM7150 / PM7150A
  • PMI8998
  • WCD9340
  • WCN3990
  • SMB1390
  • DA9313
  • Other supported ICs in the U-QSD6 series

Features:

  • Premium Japanese steel construction
  • Precision laser-cut square holes
  • 0.12mm stencil thickness
  • Designed for Qualcomm Snapdragon CPU reballing
  • High heat resistance and reusable design
  • Accurate solder ball positioning
  • Suitable for professional motherboard and BGA repair applications

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