The Amaoe U-QSD6 Qualcomm Snapdragon CPU BGA Reballing Stencil is a professional-grade 0.12mm stencil designed for accurate reballing of Qualcomm Snapdragon chipsets. Made from premium Japanese steel with precision laser-cut square holes, it provides excellent solder ball alignment and consistent results during motherboard repair.
This reusable stencil is ideal for repairing flagship Qualcomm-powered smartphones and is suitable for professional mobile repair technicians and service centers.
Compatible Chipsets Include:
Features:
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