AMAOE U-QSD4 Qualcomm CPU & RAM BGA Reballing Stencil

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SKU 178401813057976
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The AMAOE U-QSD4 Qualcomm CPU & RAM BGA Reballing Stencil is a professional-grade stencil designed for precise reballing of Qualcomm Snapdragon CPU and RAM ICs used in modern smartphones. Manufactured from premium Japanese stainless steel with a 0.12mm thickness, it delivers excellent durability, precise solder paste application, and consistent BGA solder ball alignment for professional motherboard repair.

Designed for chip-level mobile phone repair, the U-QSD4 stencil features precision laser-cut square apertures that ensure accurate solder ball placement and reliable rework results. It is reusable, heat-resistant, and ideal for repairing Qualcomm-based smartphone motherboards, CPU, RAM, and other BGA ICs.

Features

  • Premium Japanese stainless steel construction
  • Precision 0.12mm thickness
  • Designed for Qualcomm Snapdragon CPU & RAM ICs
  • Precision laser-cut square hole design
  • Accurate solder paste application
  • Heat-resistant and reusable
  • Suitable for professional motherboard and BGA IC repair
  • Ideal for mobile phone chip-level repairing work

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