AMAOE U-QSD3 Stencil for Qualcomm CPU & RAM

0 /5.0 (0 reviews)
SKU 178410981015542
People are viewing right now
Pricing
Rs149 /PC
Rs176
-15%

50 available

Minimum order qty 1

QTY
seller

Inhouse product

Message Seller
  • warranty check circle Refund Available for this producte

The AMAOE U-QSD3 Stencil is a professional-grade BGA reballing stencil designed for Qualcomm CPU and RAM IC repair. Manufactured from premium Japanese steel with a precision laser-cut square-hole design, it provides accurate solder ball placement for reliable motherboard repairs.

Its 0.12mm thickness offers excellent durability and repeated use, making it an ideal choice for mobile phone repair technicians performing CPU and RAM reballing. The stencil delivers precise alignment, clean solder joints, and consistent repair results.

Features:

  • Premium Japanese steel construction
  • Precision laser-cut square holes
  • 0.12mm thickness
  • Super hard and reusable
  • High-temperature resistant
  • Accurate CPU & RAM IC reballing
  • Suitable for professional mobile motherboard repair
  • Ideal for Qualcomm chipset repairs

Reviews & Ratings

0.0

Total Review 0

No reviews found!

Product Queries (0)

Login Or Registerto submit your questions to seller

Other Questions

No queries have been asked to the seller yet

Frequently Bought Together

No frequently bought products found!
All categories
Flash Sale
Todays Deal
Auction