AMAOE U-QSD2 BGA Reballing Stencil for Qualcomm Snapdragon IC Repair

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SKU 178418672959528
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The AMAOE U-QSD2 BGA Reballing Stencil is a professional-grade stainless steel stencil designed for accurate reballing of Qualcomm Snapdragon CPU and IC chips. With precision laser-cut openings, it delivers excellent solder ball alignment, helping technicians perform reliable motherboard repairs and chip replacements.

Made from premium stainless steel, the U-QSD2 stencil is resistant to heat, corrosion, and deformation, ensuring long-lasting performance during repeated use. It is an essential repair tool for mobile phone technicians handling advanced BGA rework and IC soldering.

Features:

  • Premium laser-cut stainless steel construction
  • Designed for Qualcomm Snapdragon CPU and IC reballing
  • High-precision solder ball alignment
  • Heat-resistant and reusable
  • Durable and corrosion-resistant
  • Suitable for professional mobile motherboard repair
  • Ideal for BGA chip rework and IC replacement

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