Amaoe U-QSD12 Stencil

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SKU 178427585777887
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The Amaoe U-QSD12 Stencil is a premium BGA reballing stencil designed specifically for Qualcomm Snapdragon CPU and RAM chip repair. Crafted from high-quality Japanese stainless steel with a precision 0.12mm thickness, it provides excellent durability, precise alignment, and reliable solder ball placement for professional smartphone motherboard repairs.

The stencil features precision laser-cut apertures that ensure uniform solder paste application and accurate reballing of Qualcomm CPU and RAM ICs. Its reusable and heat-resistant construction makes it an essential tool for mobile phone repair technicians performing BGA and SMD rework.

Features:

  • Premium Japanese stainless steel construction
  • Precision 0.12mm thickness
  • High-precision laser-cut aperture design
  • Designed for Qualcomm Snapdragon CPU & RAM reballing
  • Accurate solder ball placement
  • Reusable and heat-resistant
  • Ideal for smartphone motherboard and PCB repair
  • Suitable for professional BGA and SMD rework

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