AMAOE U-QSD10 Stencil for Qualcomm Snapdragon CPU IC Reballing is a premium 0.12mm stainless steel BGA stencil engineered for precise reballing of Qualcomm Snapdragon CPU and supporting ICs. Designed with high-precision laser-cut apertures, it ensures accurate solder ball placement, uniform solder paste distribution, and reliable chip-level repairs.
Built from high-quality stainless steel, the stencil is durable, reusable, heat-resistant, and ideal for professional mobile phone repair technicians and service centers.
Compatible Chipsets & ICs:
Key Features:
Frequently Bought Together
Products from this Seller
View All
Register now & get ₹50 in your wallet! Subscribe to our newsletter for exclusive coupons, special offers, and exciting discounts. Don't miss out—join today!
Share with Friends
Trading is more effective when you share products with friends!Share you link
Share to