AMAOE U-QSD10 Stencil for Qualcomm Snapdragon CPU IC Reballing

0 /5.0 (0 reviews)
SKU 178410475516500
People are viewing right now
Pricing
Rs149 /PC
Rs176
-15%

50 available

Minimum order qty 1

QTY
seller

Inhouse product

Message Seller
  • warranty check circle Refund Available for this producte

AMAOE U-QSD10 Stencil for Qualcomm Snapdragon CPU IC Reballing is a premium 0.12mm stainless steel BGA stencil engineered for precise reballing of Qualcomm Snapdragon CPU and supporting ICs. Designed with high-precision laser-cut apertures, it ensures accurate solder ball placement, uniform solder paste distribution, and reliable chip-level repairs.

Built from high-quality stainless steel, the stencil is durable, reusable, heat-resistant, and ideal for professional mobile phone repair technicians and service centers.

Compatible Chipsets & ICs:

  • Qualcomm Snapdragon SM8350
  • Snapdragon SM8450 (8 Gen 1)
  • Snapdragon SM8475 (8+ Gen 1)
  • Snapdragon SM8425 (7 Gen 1)
  • Snapdragon SM7475 (7+ Gen 2)
  • PM8350 / PM8350C / PM8450 PMICs
  • WCN6851 / WCN6856 Connectivity ICs
  • WCD9380 / WCD9385 Audio ICs and other supported companion chips.

Key Features:

  • Premium 0.12mm stainless steel construction
  • Precision laser-cut BGA holes
  • Accurate solder ball alignment
  • Durable, reusable, and heat-resistant
  • Ideal for Qualcomm Snapdragon CPU reballing
  • Suitable for professional motherboard and chip-level repair technicians 

Reviews & Ratings

0.0

Total Review 0

No reviews found!

Product Queries (0)

Login Or Registerto submit your questions to seller

Other Questions

No queries have been asked to the seller yet

Frequently Bought Together

No frequently bought products found!
All categories
Flash Sale
Todays Deal
Auction