The Amaoe U-QSD1 Stencil is a professional-grade BGA reballing stencil designed for Qualcomm Snapdragon CPU and RAM chip repair. Made from premium Japanese stainless steel with a precision 0.12mm thickness, it delivers accurate solder ball placement, excellent heat resistance, and long-lasting durability for professional mobile motherboard repair.
Its precision laser-cut apertures provide consistent solder paste application, making it ideal for reballing Qualcomm CPU and RAM ICs used in smartphones. The stencil is reusable, easy to clean, and suitable for professional technicians performing BGA and SMD rework.
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