Amaoe U-QSD1 Stencil

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SKU 178427559879013
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The Amaoe U-QSD1 Stencil is a professional-grade BGA reballing stencil designed for Qualcomm Snapdragon CPU and RAM chip repair. Made from premium Japanese stainless steel with a precision 0.12mm thickness, it delivers accurate solder ball placement, excellent heat resistance, and long-lasting durability for professional mobile motherboard repair.

Its precision laser-cut apertures provide consistent solder paste application, making it ideal for reballing Qualcomm CPU and RAM ICs used in smartphones. The stencil is reusable, easy to clean, and suitable for professional technicians performing BGA and SMD rework.

Features:

  • Premium Japanese stainless steel construction
  • Precision 0.12mm thickness
  • High-accuracy laser-cut aperture design
  • Designed for Qualcomm Snapdragon CPU & RAM reballing
  • Accurate solder ball positioning
  • Reusable and heat-resistant
  • Ideal for smartphone motherboard and PCB repair
  • Suitable for professional BGA and SMD rework

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