The Amaoe U-MTU5 Stencil is a precision-engineered UBGA reballing stencil designed specifically for MediaTek (MTK) CPU chip repair. Manufactured from premium Japanese stainless steel with a 0.12mm thickness, it provides excellent durability, accurate alignment, and reliable solder ball positioning for professional BGA rework.
Its high-precision laser-cut apertures ensure uniform solder paste application, making it ideal for reballing UBGA MediaTek CPU ICs used in smartphones. The stencil is reusable, heat-resistant, and designed to deliver consistent performance in professional mobile phone repair workshops.
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