The AMAOE U-MTU4 BGA Reballing Stencil is a professional-grade stainless steel stencil specially designed for MediaTek (MTK) CPU and RAM IC reballing. Manufactured using premium-quality stainless steel with 0.12mm precision thickness, it delivers accurate solder paste printing and consistent solder ball alignment for professional motherboard repair.
This stencil is ideal for technicians performing chip-level repairs on smartphones powered by MediaTek processors. Its precision laser-cut apertures ensure reliable BGA reballing, making it suitable for CPU, RAM, and motherboard IC replacement work. The stencil is reusable, heat-resistant, corrosion-resistant, and built for long-term professional use.
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