The Amaoe U-MTU1 Stencil is a premium BGA reballing stencil designed for MediaTek (MTK) CPU and RAM chip repair. Crafted from high-quality Japanese stainless steel with a precision 0.12mm thickness, it provides excellent durability, accurate chip alignment, and consistent solder ball placement during the reballing process.
Its precision laser-cut apertures ensure even solder paste distribution, making it an ideal choice for repairing MediaTek chipset motherboards used in smartphones. The stencil is reusable, heat-resistant, and suitable for professional mobile phone repair technicians and electronics repair workshops.
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