Amaoe U-MTU1 Stencil

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SKU 178427454822323
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The Amaoe U-MTU1 Stencil is a premium BGA reballing stencil designed for MediaTek (MTK) CPU and RAM chip repair. Crafted from high-quality Japanese stainless steel with a precision 0.12mm thickness, it provides excellent durability, accurate chip alignment, and consistent solder ball placement during the reballing process.

Its precision laser-cut apertures ensure even solder paste distribution, making it an ideal choice for repairing MediaTek chipset motherboards used in smartphones. The stencil is reusable, heat-resistant, and suitable for professional mobile phone repair technicians and electronics repair workshops.

Features:

  • Premium Japanese stainless steel construction
  • Precision 0.12mm thickness
  • High-precision laser-cut aperture design
  • Reusable and heat-resistant
  • Designed for MediaTek (MTK) CPU & RAM reballing
  • Accurate solder ball positioning
  • Ideal for smartphone motherboard and BGA IC repair
  • Suitable for professional mobile repair applications

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