Amaoe U-IP9 Stencil for iPhone 13, 13 Mini, 13 Pro & 13 Pro Max (A15)

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SKU 178438084980020
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The Amaoe U-IP9 Stencil is a high-precision BGA reballing stencil specially designed for Apple A15 Bionic chip reballing used in the iPhone 13 Series. Manufactured from premium Japanese stainless steel with a precision 0.12mm thickness, it delivers accurate solder ball alignment for professional CPU and IC rework.

Its precision square-hole design ensures uniform solder paste application and reliable BGA reballing, making it an essential tool for technicians performing motherboard repairs, CPU replacement, and IC maintenance on Apple devices.

Features:

  • Premium Japanese stainless steel construction
  • Precision 0.12mm thickness
  • High-accuracy square-hole design
  • Durable, reusable, and corrosion-resistant
  • Designed for Apple A15 Bionic CPU reballing
  • Ideal for professional iPhone motherboard repair
  • Ensures precise solder ball positioning

Compatible Devices:

  • iPhone 13
  • iPhone 13 Mini
  • iPhone 13 Pro
  • iPhone 13 Pro Max
  • Apple A15 Bionic CPU

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