The Amaoe U-IP9 Stencil is a high-precision BGA reballing stencil specially designed for Apple A15 Bionic chip reballing used in the iPhone 13 Series. Manufactured from premium Japanese stainless steel with a precision 0.12mm thickness, it delivers accurate solder ball alignment for professional CPU and IC rework.
Its precision square-hole design ensures uniform solder paste application and reliable BGA reballing, making it an essential tool for technicians performing motherboard repairs, CPU replacement, and IC maintenance on Apple devices.
Frequently Bought Together
Products from this Seller
View All
Register now & get ₹50 in your wallet! Subscribe to our newsletter for exclusive coupons, special offers, and exciting discounts. Don't miss out—join today!
Share with Friends
Trading is more effective when you share products with friends!Share you link
Share to