The AMAOE U-IP7 Stencil is a premium 0.12mm BGA reballing stencil specially designed for Apple iPhone 11, iPhone 11 Pro, and iPhone 11 Pro Max featuring the A13 Bionic processor. Manufactured from high-quality Japanese stainless steel, it features precision laser-cut openings for accurate solder ball placement during CPU reballing and motherboard repair.
This stencil is engineered for professional mobile repair technicians, providing excellent heat resistance, long-lasting durability, and consistent reballing results. It is reusable and ideal for advanced logic board and CPU repair.
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