AMAOE U-IP7 Stencil for iPhone 11 / 11 Pro / 11 Pro Max (A13 CPU)

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SKU 178437404902067
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The AMAOE U-IP7 Stencil is a premium 0.12mm BGA reballing stencil specially designed for Apple iPhone 11, iPhone 11 Pro, and iPhone 11 Pro Max featuring the A13 Bionic processor. Manufactured from high-quality Japanese stainless steel, it features precision laser-cut openings for accurate solder ball placement during CPU reballing and motherboard repair.

This stencil is engineered for professional mobile repair technicians, providing excellent heat resistance, long-lasting durability, and consistent reballing results. It is reusable and ideal for advanced logic board and CPU repair.

Compatible Models:

  • iPhone 11
  • iPhone 11 Pro
  • iPhone 11 Pro Max

Compatible Chipset:

  • Apple A13 Bionic CPU

Features:

  • Premium Japanese stainless steel construction
  • Precision laser-cut BGA holes
  • 0.12mm thickness for accurate reballing
  • Excellent heat resistance
  • Durable and reusable
  • Ideal for Apple A13 CPU reballing
  • Suitable for professional iPhone motherboard repair and microsoldering

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