The Amaoe U-IP10 Stencil is a professional BGA reballing stencil designed for Apple A16 Bionic chip repair in the iPhone 14 Series. Manufactured from premium Japanese stainless steel with a 0.12mm precision thickness, it ensures accurate solder ball placement for CPU and IC reballing, delivering reliable and repeatable repair results.
Its precision square-hole design allows uniform solder paste application, making it ideal for CPU replacement, motherboard servicing, and advanced BGA IC rework. The stencil is durable, reusable, and engineered for professional mobile phone repair technicians.
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