Amaoe U-HIU3 Stencil for UBGA HiSilicon Kirin CPU

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SKU 178428446291967
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The Amaoe U-HIU3 Stencil is a professional UBGA BGA reballing stencil designed specifically for HiSilicon Kirin CPU and RAM chip repair used in Huawei smartphones. Manufactured from premium Japanese stainless steel with a precision 0.12mm thickness, it offers excellent durability, precise chip alignment, and accurate solder ball placement for reliable motherboard repairs.

Its precision laser-cut apertures ensure uniform solder paste application, making it ideal for reballing HiSilicon Kirin processors and memory ICs. The stencil is reusable, heat-resistant, and designed for professional mobile phone repair technicians performing advanced BGA and SMD rework.

Features:

  • Premium Japanese stainless steel construction
  • Precision 0.12mm thickness
  • Designed for UBGA HiSilicon Kirin CPU & RAM reballing
  • High-precision laser-cut aperture design
  • Accurate solder ball positioning
  • Reusable and heat-resistant
  • Ideal for Huawei smartphone motherboard repair
  • Suitable for professional BGA and SMD rework

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