The Amaoe U-HIU3 Stencil is a professional UBGA BGA reballing stencil designed specifically for HiSilicon Kirin CPU and RAM chip repair used in Huawei smartphones. Manufactured from premium Japanese stainless steel with a precision 0.12mm thickness, it offers excellent durability, precise chip alignment, and accurate solder ball placement for reliable motherboard repairs.
Its precision laser-cut apertures ensure uniform solder paste application, making it ideal for reballing HiSilicon Kirin processors and memory ICs. The stencil is reusable, heat-resistant, and designed for professional mobile phone repair technicians performing advanced BGA and SMD rework.
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