The AMAOE U-HIU2 BGA Reballing Stencil is a precision-engineered stainless steel stencil designed for HiSilicon Kirin CPU and IC reballing used in Huawei smartphones. Manufactured with advanced laser-cut technology, it provides precise solder ball alignment for reliable BGA chip repair, IC replacement, and motherboard maintenance.
Constructed from premium-grade stainless steel, the U-HIU2 stencil offers outstanding heat resistance, corrosion resistance, and durability for repeated professional use. It is an essential tool for technicians performing advanced motherboard repairs and CPU reballing on Huawei devices powered by HiSilicon Kirin chipsets.
Features:
Frequently Bought Together
Products from this Seller
View All
Register now & get ₹50 in your wallet! Subscribe to our newsletter for exclusive coupons, special offers, and exciting discounts. Don't miss out—join today!
Share with Friends
Trading is more effective when you share products with friends!Share you link
Share to