AMAOE U-HIU2 BGA Reballing Stencil for HiSilicon Kirin CPU IC Repair

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SKU 178420993604077
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The AMAOE U-HIU2 BGA Reballing Stencil is a precision-engineered stainless steel stencil designed for HiSilicon Kirin CPU and IC reballing used in Huawei smartphones. Manufactured with advanced laser-cut technology, it provides precise solder ball alignment for reliable BGA chip repair, IC replacement, and motherboard maintenance.

Constructed from premium-grade stainless steel, the U-HIU2 stencil offers outstanding heat resistance, corrosion resistance, and durability for repeated professional use. It is an essential tool for technicians performing advanced motherboard repairs and CPU reballing on Huawei devices powered by HiSilicon Kirin chipsets.

Features:

  • Premium laser-cut stainless steel construction
  • Designed for HiSilicon Kirin CPU and IC reballing
  • High-precision solder ball alignment
  • Heat-resistant, corrosion-resistant, and reusable
  • Durable for long-term professional use
  • Ideal for Huawei motherboard repair and CPU replacement
  • Suitable for professional mobile phone repair technicians

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