Amaoe U-HIS3 Stencil

0 /5.0 (0 reviews)
SKU 178428605839039
People are viewing right now
Pricing
Rs149 /PC
Rs176
-15%

50 available

Minimum order qty 1

QTY
seller

Inhouse product

Message Seller
  • warranty check circle Refund Available for this producte

The Amaoe U-HIS3 Stencil is a professional BGA reballing stencil specially designed for HiSilicon Kirin CPU and RAM chip repair used in Huawei smartphones. Manufactured from premium Japanese stainless steel with a precision 0.12mm thickness, it provides exceptional durability, accurate chip alignment, and precise solder ball placement for reliable motherboard repairs.

Featuring high-precision laser-cut apertures, the U-HIS3 stencil ensures uniform solder paste application and consistent reballing results. Its reusable and heat-resistant construction makes it an essential tool for professional technicians performing advanced BGA and SMD rework on Huawei device motherboards.

Features:

  • Premium Japanese stainless steel construction
  • Precision 0.12mm thickness
  • Designed for HiSilicon Kirin CPU & RAM reballing
  • High-precision laser-cut aperture design
  • Accurate solder ball alignment
  • Reusable and heat-resistant
  • Ideal for Huawei smartphone motherboard repair
  • Suitable for professional BGA and SMD rework

Reviews & Ratings

0.0

Total Review 0

No reviews found!

Product Queries (0)

Login Or Registerto submit your questions to seller

Other Questions

No queries have been asked to the seller yet

Frequently Bought Together

No frequently bought products found!
All categories
Flash Sale
Todays Deal
Auction