The Amaoe U-HIS3 Stencil is a professional BGA reballing stencil specially designed for HiSilicon Kirin CPU and RAM chip repair used in Huawei smartphones. Manufactured from premium Japanese stainless steel with a precision 0.12mm thickness, it provides exceptional durability, accurate chip alignment, and precise solder ball placement for reliable motherboard repairs.
Featuring high-precision laser-cut apertures, the U-HIS3 stencil ensures uniform solder paste application and consistent reballing results. Its reusable and heat-resistant construction makes it an essential tool for professional technicians performing advanced BGA and SMD rework on Huawei device motherboards.
Features:
Frequently Bought Together
Products from this Seller
View All
Register now & get ₹50 in your wallet! Subscribe to our newsletter for exclusive coupons, special offers, and exciting discounts. Don't miss out—join today!
Share with Friends
Trading is more effective when you share products with friends!Share you link
Share to