Amaoe U-HIS2 Stencil

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SKU 178428670957243
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The Amaoe U-HIS2 Stencil is a high-precision BGA reballing stencil designed for HiSilicon Kirin CPU and RAM chip repair used in Huawei smartphones. Made from premium Japanese stainless steel with a precision 0.12mm thickness, it ensures excellent durability, precise chip alignment, and accurate solder ball placement during BGA rework.

Its laser-cut apertures provide uniform solder paste application and reliable reballing performance for HiSilicon Kirin processors and memory ICs. The stencil is reusable, heat-resistant, and ideal for professional mobile phone repair technicians performing motherboard and IC repairs.

Features:

  • Premium Japanese stainless steel construction
  • Precision 0.12mm thickness
  • Designed for HiSilicon Kirin CPU & RAM reballing
  • High-precision laser-cut aperture design
  • Accurate solder ball positioning
  • Reusable and heat-resistant
  • Ideal for Huawei smartphone motherboard repair
  • Suitable for professional BGA and SMD rework

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