The Amaoe U-HIS2 Stencil is a high-precision BGA reballing stencil designed for HiSilicon Kirin CPU and RAM chip repair used in Huawei smartphones. Made from premium Japanese stainless steel with a precision 0.12mm thickness, it ensures excellent durability, precise chip alignment, and accurate solder ball placement during BGA rework.
Its laser-cut apertures provide uniform solder paste application and reliable reballing performance for HiSilicon Kirin processors and memory ICs. The stencil is reusable, heat-resistant, and ideal for professional mobile phone repair technicians performing motherboard and IC repairs.
Features:
Frequently Bought Together
Products from this Seller
View All
Register now & get ₹50 in your wallet! Subscribe to our newsletter for exclusive coupons, special offers, and exciting discounts. Don't miss out—join today!
Share with Friends
Trading is more effective when you share products with friends!Share you link
Share to