Amaoe U-HIS1 Stencil

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SKU 178428861485087
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The Amaoe U-HIS1 Stencil is a premium BGA reballing stencil designed for HiSilicon Kirin CPU and RAM chip repair in Huawei smartphones. Manufactured from high-quality Japanese stainless steel with a precision 0.12mm thickness, it provides outstanding durability, accurate chip alignment, and reliable solder ball placement for professional motherboard repairs.

The stencil features precision laser-cut apertures that ensure uniform solder paste application and precise reballing of HiSilicon Kirin processors and memory ICs. It is reusable, heat-resistant, and an essential tool for mobile phone repair professionals performing advanced BGA and SMD rework.

Features:

  • Premium Japanese stainless steel construction
  • Precision 0.12mm thickness
  • Designed for HiSilicon Kirin CPU & RAM reballing
  • High-precision laser-cut aperture design
  • Accurate solder ball positioning
  • Reusable and heat-resistant
  • Ideal for Huawei smartphone motherboard repair
  • Suitable for professional BGA and SMD rework

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