The AMAOE U-APU9 Stencil is a professional BGA reballing stencil designed for Apple A16, A17, and A18 CPU & RAM chip repair. Engineered from premium Japanese stainless steel, it provides exceptional accuracy for CPU and memory chip reballing, ensuring precise solder ball alignment and reliable chip-level repairs.
Featuring a high-precision square-hole design, the U-APU9 stencil enables uniform solder paste application and accurate solder ball placement. Its reusable, heat-resistant construction makes it ideal for professional technicians repairing the latest iPhone logic boards equipped with Apple A16, A17, and A18 processors. The stencil is specifically designed for Apple A16 to A18 CPU and RAM reballing applications.
Features:
Frequently Bought Together
Products from this Seller
View All
Register now & get ₹50 in your wallet! Subscribe to our newsletter for exclusive coupons, special offers, and exciting discounts. Don't miss out—join today!
Share with Friends
Trading is more effective when you share products with friends!Share you link
Share to