AMAOE U-APU9 Stencil for Apple A16 to A18 CPU & RAM Reballing

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SKU 178436125915499
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The AMAOE U-APU9 Stencil is a professional BGA reballing stencil designed for Apple A16, A17, and A18 CPU & RAM chip repair. Engineered from premium Japanese stainless steel, it provides exceptional accuracy for CPU and memory chip reballing, ensuring precise solder ball alignment and reliable chip-level repairs.

Featuring a high-precision square-hole design, the U-APU9 stencil enables uniform solder paste application and accurate solder ball placement. Its reusable, heat-resistant construction makes it ideal for professional technicians repairing the latest iPhone logic boards equipped with Apple A16, A17, and A18 processors. The stencil is specifically designed for Apple A16 to A18 CPU and RAM reballing applications.

Features:

  • Designed for Apple A16, A17, and A18 CPU & RAM reballing.
  • Premium Japanese stainless steel construction.
  • High-precision square-hole design for accurate solder ball placement.
  • Heat-resistant, corrosion-resistant, and reusable.
  • Suitable for CPU and RAM BGA chip repair.
  • Provides clean, consistent solder joints.
  • Ideal for professional iPhone motherboard repair technicians.

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