Amaoe U-APU4 Stencil

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SKU 178428390122629
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The Amaoe U-APU4 Stencil is a professional BGA reballing stencil designed for Apple A-Series CPU and RAM chip repair used in iPhone motherboards. Made from premium Japanese stainless steel with a precision 0.12mm thickness, it delivers exceptional durability, accurate alignment, and consistent solder ball placement during BGA rework.

The stencil features precision laser-cut apertures that ensure uniform solder paste application, making it ideal for reballing Apple A-Series processors and integrated memory chips. It is reusable, heat-resistant, and an essential tool for professional iPhone motherboard repair technicians.

Features:

  • Premium Japanese stainless steel construction
  • Precision 0.12mm thickness
  • Designed for Apple A-Series CPU & RAM reballing
  • High-precision laser-cut aperture design
  • Accurate solder ball placement
  • Reusable and heat-resistant
  • Ideal for iPhone motherboard and PCB repair
  • Suitable for professional BGA and SMD rework

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