Amaoe U-APU3 Stencil

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SKU 178384386159838
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The Amaoe U-APU3 Stencil is a high-precision BGA reballing stencil specially designed for Apple CPU and IC reballing applications. Made from premium Japanese stainless steel with precision laser-cut square holes, it ensures accurate solder ball alignment and reliable reballing results. With a 0.12 mm thickness, this reusable stencil offers excellent heat resistance, durability, and consistent performance for professional mobile phone motherboard repairs.

Ideal for repairing Apple iPhone logic boards and compatible ICs, the U-APU3 stencil helps technicians perform precise solder paste application and BGA chip reballing with improved efficiency and accuracy.

Key Features:

  • Designed for Apple CPU and IC reballing
  • Premium Japanese stainless steel construction
  • Precision laser-cut square-hole design
  • 0.12 mm thickness for accurate solder ball placement
  • Heat-resistant, durable, and reusable
  • Suitable for iPhone motherboard and PCB repair
  • Ideal for professional mobile repair technicians and service centers
  • Provides precise solder paste application for BGA chip repair

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