The Amaoe U-APU3 Stencil is a high-precision BGA reballing stencil specially designed for Apple CPU and IC reballing applications. Made from premium Japanese stainless steel with precision laser-cut square holes, it ensures accurate solder ball alignment and reliable reballing results. With a 0.12 mm thickness, this reusable stencil offers excellent heat resistance, durability, and consistent performance for professional mobile phone motherboard repairs.
Ideal for repairing Apple iPhone logic boards and compatible ICs, the U-APU3 stencil helps technicians perform precise solder paste application and BGA chip reballing with improved efficiency and accuracy.
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