AMAOE SU-3 Stencil for Spreadtrum CPU is a high-precision BGA reballing stencil specially designed for Spreadtrum (UNISOC) CPU chip repair. Manufactured from premium Japanese stainless steel with a 0.12mm thickness, it delivers accurate solder ball alignment for reliable reballing and motherboard repair.
The stencil is reusable, durable, and ideal for professional mobile phone repair technicians performing CPU rework, chip replacement, and solder paste application. It ensures precise solder paste deposition, improving repair quality and efficiency.
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