AMAOE SU-1 Stencil for Spreadtrum CPU Reballing

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SKU 178436191004743
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The AMAOE SU-1 Stencil is a high-precision BGA reballing stencil designed for Spreadtrum (UNISOC) CPU chip repair and reballing. Manufactured from premium Japanese stainless steel with a 0.12mm thickness, it ensures precise solder ball alignment for reliable CPU reballing and professional motherboard repair. The stencil features a square-hole design for uniform solder paste application and accurate solder ball placement.

The SU-1 stencil is compatible with several Spreadtrum processors, including SC7730, SC7731, SC8830, SC9830, SC8825, and SC7715, making it a versatile tool for technicians working on UNISOC-based smartphones. It is reusable, heat-resistant, and ideal for professional chip-level mobile repair.

Features:

  • Designed for Spreadtrum (UNISOC) CPU reballing.
  • Compatible with SC7730, SC7731, SC8830, SC9830, SC8825, and SC7715 CPUs.
  • Premium Japanese stainless steel construction.
  • Precision 0.12mm thickness.
  • High-precision square-hole design for accurate solder ball placement.
  • Heat-resistant, corrosion-resistant, and reusable.
  • Ideal for professional mobile motherboard and BGA chip repair.

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