Amaoe SM7550 BGA Reballing Stencil

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SKU 178427707715016
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The Amaoe SM7550 BGA Reballing Stencil is a precision-engineered stencil designed for Qualcomm Snapdragon CPU and RAM reballing. Manufactured from premium Japanese stainless steel with a 0.12mm thickness, it delivers exceptional accuracy, durability, and reliable solder ball alignment for professional smartphone motherboard repair.

This stencil supports multiple Qualcomm Snapdragon chipsets, including Snapdragon 7s Gen 3 (SM7635), Snapdragon 6 Gen 1 (SM6450), Snapdragon 4 Gen 2 (SM4450), and SM7550 series, making it an excellent choice for technicians servicing the latest Android smartphones. Its laser-cut apertures ensure uniform solder paste application and accurate BGA rework.

Compatible Chipsets:

  • Snapdragon 7s Gen 3 (SM7635)
  • Snapdragon 7 Series (SM7550)
  • Snapdragon 6 Gen 1 (SM6450)
  • Snapdragon 4 Gen 2 (SM4450)

Features:

  • Premium Japanese stainless steel construction
  • Precision 0.12mm thickness
  • High-precision laser-cut aperture design
  • Supports multiple Qualcomm Snapdragon chipsets
  • Accurate CPU & RAM solder ball positioning
  • Reusable and heat-resistant
  • Ideal for smartphone motherboard and PCB repair
  • Suitable for professional BGA and SMD rework

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