The Amaoe SM7550 BGA Reballing Stencil is a precision-engineered stencil designed for Qualcomm Snapdragon CPU and RAM reballing. Manufactured from premium Japanese stainless steel with a 0.12mm thickness, it delivers exceptional accuracy, durability, and reliable solder ball alignment for professional smartphone motherboard repair.
This stencil supports multiple Qualcomm Snapdragon chipsets, including Snapdragon 7s Gen 3 (SM7635), Snapdragon 6 Gen 1 (SM6450), Snapdragon 4 Gen 2 (SM4450), and SM7550 series, making it an excellent choice for technicians servicing the latest Android smartphones. Its laser-cut apertures ensure uniform solder paste application and accurate BGA rework.
Compatible Chipsets:
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