The AMAOE SM6225 Stencil is a precision BGA reballing stencil specifically designed for the Qualcomm Snapdragon 680 (SM6225) processor. Manufactured from premium Japanese stainless steel with a 0.12mm thickness, it provides accurate solder ball alignment for professional CPU reballing and motherboard repair.
Designed for chip-level mobile phone repairs, the stencil features a precision square-hole layout that ensures even solder paste application and reliable solder ball placement. Its durable, reusable construction offers excellent heat resistance and long-lasting performance, making it an essential tool for professional mobile repair technicians.
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