AMAOE SM6225 Stencil for Qualcomm Snapdragon 680 (SM6225) CPU Reballing

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SKU 178435814957911
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The AMAOE SM6225 Stencil is a precision BGA reballing stencil specifically designed for the Qualcomm Snapdragon 680 (SM6225) processor. Manufactured from premium Japanese stainless steel with a 0.12mm thickness, it provides accurate solder ball alignment for professional CPU reballing and motherboard repair.

Designed for chip-level mobile phone repairs, the stencil features a precision square-hole layout that ensures even solder paste application and reliable solder ball placement. Its durable, reusable construction offers excellent heat resistance and long-lasting performance, making it an essential tool for professional mobile repair technicians.

Features:

  • Designed for Qualcomm Snapdragon 680 (SM6225) CPU reballing.
  • Premium Japanese stainless steel construction.
  • Precision 0.12mm thickness for accurate solder ball placement.
  • Square-hole design for uniform solder paste application.
  • Heat-resistant, corrosion-resistant, and reusable.
  • Ideal for CPU, IC, and BGA chip reballing.
  • Suitable for professional mobile motherboard repair.

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