AMAOE Samsung Galaxy Z Flip 4 BGA Reballing Stencil

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SKU 178435708164458
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The AMAOE Samsung Galaxy Z Flip 4 Stencil is a high-precision BGA reballing stencil specially designed for chip-level repair and motherboard maintenance of the Samsung Galaxy Z Flip 4. Crafted from premium Japanese stainless steel with a 0.12mm thickness, it ensures precise solder ball alignment for CPU, IC, and BGA chip reballing.

The precision square-hole design allows for accurate solder paste application and consistent solder ball placement, making it ideal for professional mobile repair technicians. Its durable, reusable construction offers excellent heat resistance and long service life for repeated repair work.

Features:

  • Designed for Samsung Galaxy Z Flip 4 motherboard repair.
  • Suitable for CPU, IC, and BGA chip reballing.
  • Premium Japanese stainless steel construction.
  • Precision 0.12mm thickness for accurate solder ball placement.
  • Square-hole design for clean and reliable soldering.
  • Heat-resistant, corrosion-resistant, and reusable.
  • Ideal for professional mobile phone repair workshops.

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