AMAOE SAM-21 0.12mm Stencil for Samsung CPU IC Reballing

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SKU 178453628051543
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The AMAOE SAM-21 0.12mm Stencil is a professional-grade BGA reballing stencil engineered for Samsung smartphone CPU and motherboard IC repair. Manufactured from premium Japanese stainless steel with a precision 0.12mm thickness, this stencil provides exceptional durability, precise solder ball alignment, and consistent performance for advanced chip-level repairs.

Its precision square-hole design enables uniform solder ball placement, helping technicians achieve reliable BGA reballing with minimal errors. The stencil is heat-resistant, reusable, and suitable for repairing Samsung motherboard CPU ICs in professional service centers and mobile repair workshops.

Whether you're replacing damaged CPU ICs or restoring Samsung logic boards, the AMAOE SAM-21 Stencil is an essential tool for accurate and efficient motherboard repair.

Key Features

  • Premium Japanese stainless steel construction
  • Precision 0.12mm thickness
  • Designed for Samsung CPU IC reballing
  • High-precision square-hole design
  • Accurate solder ball positioning
  • Heat-resistant and reusable
  • Corrosion-resistant and durable
  • Professional-grade quality
  • Ideal for chip-level motherboard repair

Applications

  • Samsung Smartphone Motherboard Repair
  • Samsung CPU IC Reballing
  • BGA IC Rework
  • Chip-Level Mobile Repair
  • Mobile Phone Motherboard Maintenance
  • Professional Electronics Repair 

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