AMAOE SAM-20 Stencil for Samsung Galaxy A15 (A156U/A156E) Dimensity 6100+ MT6835V CPU IC BGA Reballing (0.12mm)

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SKU 178461714268466
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The AMAOE SAM-20 Stencil is a high-precision 0.12mm BGA reballing stencil designed for Samsung Galaxy A15 (A156U/A156E) smartphones powered by the MediaTek Dimensity 6100+ (MT6835V) processor. Manufactured from premium Japanese stainless steel, this stencil features precision laser-cut apertures for accurate solder ball placement, making CPU, PMIC, and motherboard IC reballing fast, precise, and reliable.

Designed for professional mobile repair technicians and electronics service centers, the SAM-20 stencil offers excellent heat resistance, long-lasting durability, and consistent performance during motherboard repair. It is an essential tool for repairing Samsung A-series smartphones using MediaTek chipsets.

Key Features

  • Premium Japanese stainless steel construction
  • Precision laser-cut BGA openings
  • 0.12mm thickness for accurate solder ball alignment
  • High-temperature resistant
  • Durable and reusable
  • Professional-grade quality
  • Designed for MediaTek Dimensity 6100+ (MT6835V) CPU reballing
  • Suitable for CPU, PMIC, Power IC, and motherboard IC repairs

Compatible Models

  • Samsung Galaxy A15 (A156U)
  • Samsung Galaxy A15 (A156E)
  • MediaTek Dimensity 6100+ (MT6835V)
  • Compatible PMIC, Power IC, and supporting motherboard IC layouts
  • Suitable for professional Samsung motherboard BGA reballing and repair

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